论文标题
基于超声分层的粘附测试，用于范德华异质结构的高通量组装
Ultrasonic Delamination Based Adhesion Testing for High-Throughput Assembly of van der Waals Heterostructures
论文作者
论文摘要
组装成范德华（VDW）异质结构中的二维（2D）材料包含可用于潜在设备应用的机械，光学和电气性能的无限组合。至关重要的是，这些结构需要控制界面粘附，以便建造它们并具有足够的完整性以在其整合后生存工业制造过程。在这里，我们立即使用超声分层阈值测试来确定常规SIO $ _ {2} $/SI基板上各种去角质2D材料的粘附质量。该测试使我们能够基于在超声浴中存活的2D薄片的百分比来快速推断相对底物粘附，从而可以控制高或差粘附的过程参数。我们利用这种对粘附的控制来优化VDW异质结构组装过程，在此我们表明，相对于彼此相比高或低底物粘附的样品可以选择性地用于构建高通量VDW堆栈。我们不将聚合物邮票的粘附到具有恒定2D-底物粘附的2D材料上，而是对2D覆盖的粘附，并固定邮票粘附到2D材料。可以在没有任何聚合物熔化步骤的情况下重复使用聚合物邮票，从而避免高温（<120°C）并允许高通量产生。 We show that this procedure can be used to create high-quality 2D twisted bilayer graphene on SiO$_{2}$/Si, characterized with atomic force microscopy and Raman spectroscopic mapping, as well as low-angle twisted bilayer WSe$_{2}$ on h-BN/SiO$_{2}$/Si, where we show direct real-space visualization of Moiré重建具有倾斜角依赖性扫描电子显微镜。
Two-dimensional (2D) materials assembled into van der Waals (vdW) heterostructures contain unlimited combinations of mechanical, optical, and electrical properties that can be harnessed for potential device applications. Critically, these structures require control over interfacial adhesion in order for them to be constructed and to have enough integrity to survive industrial fabrication processes upon their integration. Here, we promptly determine the quality of adhesion of various exfoliated 2D materials on conventional SiO$_{2}$/Si substrates using ultrasonic delamination threshold testing. This test allows us to quickly infer relative substrate adhesion based on the percent area of 2D flakes that survive a fixed time in an ultrasonic bath, allowing for control over process parameters that yield high or poor adhesion. We leverage this control of adhesion to optimize the vdW heterostructure assembly process, where we show that samples with high or low substrate adhesion relative to each other can be used selectively to construct high-throughput vdW stacks. Instead of tuning the adhesion of polymer stamps to 2D materials with constant 2D-substrate adhesion, we tune the 2D-substrate adhesion with constant stamp adhesion to 2D materials. The polymer stamps may be reused without any polymer melting steps, thus avoiding high temperatures (<120°C) and allowing for high-throughput production. We show that this procedure can be used to create high-quality 2D twisted bilayer graphene on SiO$_{2}$/Si, characterized with atomic force microscopy and Raman spectroscopic mapping, as well as low-angle twisted bilayer WSe$_{2}$ on h-BN/SiO$_{2}$/Si, where we show direct real-space visualization of moiré reconstruction with tilt angle-dependent scanning electron microscopy.
