论文标题
激光施加的密封密封件用于集成的原子设备
Laser-actuated hermetic seals for integrated atomic devices
论文作者
论文摘要
Atomic devices such as atomic clocks and optically-pumped magnetometers rely on the interrogation of atoms contained in a cell whose inner content has to meet high standards of purity and accuracy.玻璃吹玻璃技术和工艺已经发展了数十年，以在宏观蒸气细胞中达到此类标准。 With the emergence of chip-scale atomic devices, the need for miniaturization and mass fabrication has led to the adoption of microfabrication techniques to make millimeter-scale vapor cells.但是，仍然存在许多缺点，并且没有任何过程能够匹配玻璃吹动细胞的质量和多功能性。 Here, we introduce a novel approach to structure, fill and seal microfabricated vapor cells inspired from the century-old approach of glass-blowing. In particular we demonstrate opening and closing single-use zero-leak microfabricated valves, actuated exclusively by laser, and operating in the same way as the "make-seals" and "break-seals" found in the filling apparatus of traditional cells.这种结构被用来填充晶圆级的葡萄腔蒸气细胞。制成结构由一个可以局部加热并偏转以密封微通道的玻璃膜组成。断裂是通过突破腔之间的硅壁来获得的。这种新方法允许调整以前仅限于玻璃吹动的细胞的过程。它也可以扩展到微型机械系统（MEM）设备的真空微电子和真空包装。
Atomic devices such as atomic clocks and optically-pumped magnetometers rely on the interrogation of atoms contained in a cell whose inner content has to meet high standards of purity and accuracy. Glass-blowing techniques and craftsmanship have evolved over many decades to achieve such standards in macroscopic vapor cells. With the emergence of chip-scale atomic devices, the need for miniaturization and mass fabrication has led to the adoption of microfabrication techniques to make millimeter-scale vapor cells. However, many shortcomings remain and no process has been able to match the quality and versatility of glass-blown cells. Here, we introduce a novel approach to structure, fill and seal microfabricated vapor cells inspired from the century-old approach of glass-blowing. In particular we demonstrate opening and closing single-use zero-leak microfabricated valves, actuated exclusively by laser, and operating in the same way as the "make-seals" and "break-seals" found in the filling apparatus of traditional cells. Such structures are employed to fill cesium vapor cells at the wafer-level. The make-seal structure consists of a glass membrane that can be locally heated and deflected to seal a microchannel. The break-seal is obtained by breaching a silicon wall between cavities. This new approach allows adapting processes previously restricted to glass-blown cells. It can also be extended to vacuum microelectronics and vacuum-packaging of micro-electro-mechanical systems (MEMS) devices.
