论文标题

半手p型半导体baagp的机械,光电和热电特性:DFT研究

Mechanical, optoelectronic and thermoelectric properties of half-Heusler p-type semiconductor BaAgP: A DFT investigation

论文作者

Parvin, F., Hossain, M. A., Ahmed, M. I., Akter, K., Islam, A. K. M. A.

论文摘要

我们已经使用基于密度函数理论的计算,首次探索了P型半手型化合物BaAGP的机械,电子,光学和热电性能。该化合物的机械和动力学稳定性分别研究出生稳定标准和声子分散曲线。它是柔软的,延性的和弹性的各向异性的。沿A轴的原子键比沿C轴的键更强。计算出的电子结构表明,所研究的化合物是间接带隙半导体。电荷密度分布图和mulliken种群的分析表明,BaaGP中的键合是共价和离子的混合物。光学特征证实了BaaGP是光学各向异性的。可见到紫外线区域的高吸收系数和低反射率使该化合物成为太阳能电池和光电设备应用的候选者。通过求解Boltzmann半古典传输方程,已经评估了热电特性。沿A轴为1000K时计算出的功率因数为35.2 micro-W/cmk2(tau = 10-14 s),比SNSE大约3.5倍,SNSE是一种有希望的分层热电材料。优点的热电图,BAAGP的ZT为0.44,由于导热率很高,因此很小。因此,导热率的降低对于在设备应用中增强BAAGP的热电性能至关重要。

We have explored the mechanical, electronic, optical and thermoelectric properties of p-type half-Heusler compound BaAgP for the first time using density functional theory based calculations. The mechanical and dynamical stability of this compound is confirmed by studying the Born stability criteria and phonon dispersion curve, respectively. It is soft, ductile and elastically anisotropic. The atomic bonding along a-axis is stronger than that along c-axis. The calculated electronic structure reveals that the studied compound is an indirect band gap semiconductor. The analysis of charge density distribution map and Mulliken population reveals that the bonding in BaAgP is a mixture of covalent and ionic. The optical features confirm that BaAgP is optically anisotropic. The high absorption coefficient and low reflectivity in the visible to ultraviolet region make this compound a possible candidate for solar cell and optoelectronic device applications. The thermoelectric properties have been evaluated by solving the Boltzmann semi-classical transport equations. The calculated power factor at 1000K along a-axis is 35.2 micro-W/cmK2 (with tau=10-14 s) which is ~3.5 times larger than that of SnSe, a promising layered thermoelectric materials. The thermoelectric figure of merit, ZT of BaAgP is 0.44 which is small due to high thermal conductivity. So the reduction of thermal conductivity is essential to enhance thermoelectric performance of BaAgP in device applications.

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