论文标题
热成型电路板：具有热弯曲的高导电自由式3D打印电路板的制造
Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending
论文作者
论文摘要
使用台式打印机制造3D打印电子产品，随着电导性热塑性丝的最新发展，已经变得更加易于使用。由于它们在垂直方向上的印刷轨迹上的高阻力和困难，因此大多数应用仅限于电容感应。在本文中，我们介绍了热成型电路板（TCB），这是一种新型方法，该方法采用3D印刷塑料的热功能来构建各种双面，刚性和高度导电的自由式电路板，可以通过铜电镀来承受高电流应用。为了说明TCB的能力，我们展示了具有各种形状，电特性和相互作用机制的一系列示例。我们还向现有的CAD环境展示了一个新的设计工具扩展，该工具允许用户参数绘制基板和导电跟踪，并导出3D可打印文件。 TCB是一种廉价且易于使用的制造技术，旨在扩大HCI研究人员的参与。
Fabricating 3D printed electronics using desktop printers has become more accessible with recent developments in conductive thermoplastic filaments. Because of their high resistance and difficulties in printing traces in vertical directions, most applications are restricted to capacitive sensing. In this paper, we introduce Thermoformed Circuit Board (TCB), a novel approach that employs the thermoformability of the 3D printed plastics to construct various double-sided, rigid and highly conductive freeform circuit boards that can withstand high current applications through copper electroplating. To illustrate the capability of the TCB, we showcase a range of examples with various shapes, electrical characteristics and interaction mechanisms. We also demonstrate a new design tool extension to an existing CAD environment that allows users to parametrically draw the substrate and conductive trace, and export 3D printable files. TCB is an inexpensive and highly accessible fabrication technique intended to broaden HCI researcher participation.
