论文标题
裂纹定位以及应力增强与热噪声之间的相互作用
Crack Localization and the Interplay between Stress Enhancement and Thermal Noise
论文作者
论文摘要
我们通过使用局部负载分布纤维束模型研究了热波动和应力增强过程中的竞争。通过定义构成纤维温度和弹性能的故障概率来引入热噪声。我们观察到，在有限的温度和低无序强度下，在没有任何热波动的情况下核定的故障过程在施加的应力足够低时会在空间上不相关。该限制中模型的动力学与普通渗透的普遍性类别紧密。当施加应力的增加超出阈值时，随时间生长的系统中会出现局部裂缝。我们确定温度空间和施加应力的局部和随机故障过程之间的边界，发现应力的阈值与局部裂纹生长的发作相对应随着温度的升高而增加。
We study the competition between thermal fluctuations and stress enhancement in the failure process of a disordered system by using a local load sharing fiber bundle model. The thermal noise is introduced by defining a failure probability that constitutes the temperature and elastic energy of the fibers. We observe that at a finite temperature and low disorder strength, the failure process, which nucleate in the absence of any thermal fluctuation, becomes spatially uncorrelated when the applied stress is sufficiently low. The dynamics of the model in this limit lies closely to the universality class of ordinary percolation. When applied stress is increased beyond a threshold value, localized fractures appear in the system that grow with time. We identify the boundary between the localized and random failure process in the space of temperature and applied stress, and find that the threshold of stress corresponding to the onset of localized crack growth increases with the increase of temperature.
