论文标题
冷却纳米电子设备到超低温度的进展
Progress in cooling nanoelectronic devices to ultra-low temperatures
论文作者
论文摘要
在这里,我们回顾了冷却微/纳米电机设备的最新进展。全球许多小组都在努力产生片上芯片电子温度,这是由于观察新的物理效应并提高量子技术,传感器和计量标准的性能的可能性。挑战是一个长期存在的挑战,报告的片上电子温度最低,持续了15年以上。尽管事实是,自20世纪中叶以来,Microkelvin温度就可以在散装材料中获得。在这篇评论中,我们描述了过去五年中使用新的冷却技术取得的进步。发展是由在超高温度下对电子设备的纳米级物理学,材料特性和热流的理解的改善所驱动的,并涉及大学与研究所,物理学家和工程师之间的合作。我们希望这项审查将作为当前最新的摘要,并为未来的发展提供路线图。我们专注于在实验中表明达到亚米甲基电子温度的潜力的技术。特别是,我们专注于芯片上的电磁制冷。多组已经使用该技术达到1 MK左右的温度,当前最低温度低于0.5 mk。
Here we review recent progress in cooling micro/nanoelectronic devices significantly below 10 mK. A number of groups worldwide are working to produce sub-millikelvin on-chip electron temperatures, motivated by the possibility of observing new physical effects and improving the performance of quantum technologies, sensors and metrological standards. The challenge is a longstanding one, with the lowest reported on-chip electron temperature having remained around 4 mK for more than 15 years. This is despite the fact that microkelvin temperatures have been accessible in bulk materials since the mid 20th century. In this review we describe progress made in the last five years using new cooling techniques. Developments have been driven by improvements in the understanding of nanoscale physics, material properties and heat flow in electronic devices at ultralow temperatures, and have involved collaboration between universities and institutes, physicists and engineers. We hope that this review will serve as a summary of the current state-of-the-art, and provide a roadmap for future developments. We focus on techniques that have shown, in experiment, the potential to reach sub-millikelvin electron temperatures. In particular, we focus on on-chip demagnetisation refrigeration. Multiple groups have used this technique to reach temperatures around 1 mK, with a current lowest temperature below 0.5 mK.